Intelligent packaging to reduce fraud, theft and food waste

General news0
Guido Schmitz
Guide Schmitz from Bayer at an intelligent packaging gab-fest

The Active & Intelligent Packaging Industry Association, AIPIA, has confirmed that the speaker line-up at its November Congress in Chicago, USA includes Dr. Lee Nicholson, Director at PepsiCo’s Corporate R&D. He leads PepsiCo Advanced Research’s Packaging Innovation Group at the Skyline Lab and will share his views on the Opportunities In Interactive Packaging for Consumer Goods.
The event, which is held in conjunction with PACK EXPO International and Pharma EXPO, owned and produced by PMMI, The Association for Packaging and Processing Technologies from 2-4 November at McCormick Place, Chicago, is set to be the largest gathering for Active & Intelligent Packaging technologies ever held.Other recent, important speaker confirmations include Andy Hobsbawm, Founder and Chief Marketing Officer of  Evrythng, who will discuss Where the Smart Money is Going in Smart Packaging; Sumitra Rajagopalan, Founder and CEO of Bioasta Tech who will look at Creating Breakthrough Packaging Solutions with Intelligent Polymers; and Laurent Tonnelier, co-founder and CEO of mobiLead, covering the Internet of Things: from product identification to related content and services.
”This is the most comprehensive program of speakers we have ever assembled” Eef de Ferrante, Executive Director of AIPIA. “There is a huge amount of knowledge and information across the entire Active and Intelligent Packaging spectrum and we expect a very stimulating three days,” he added.
“We are particularly pleased to welcome a representative of PAC FOOD WASTE, the Packaging Association, to our forum. Rachel Morier will explore the interplay between packaging innovation and causes of food waste, a highly topical subject” explained de Ferrante.

Leave a Comment

You must be logged in to post a comment.

This site uses Akismet to reduce spam. Learn how your comment data is processed.